IP3 2023 – Semiconductor Manufacturing 1 (LOT 11574)

This lot is generally related to semiconductor fabrication. Disclosed are techniques to easily and efficiently fabricate site selective copper (Cu) plating on substrates. The technique provides a substrate having a wet surface with a volatile liquid, selectively inkjet prints a suspension of nanoparticles in the liquid and dries the liquid to form a second pattern of nanoparticles. The technique further selectively electroless plates the second pattern to form an inhomogeneous electrically conductive metal pattern. The technology may be implemented in fabrication of semiconductor components, parts, elements, circuits, chips, ICs, electrodes, etc.